Top Sale SMT Reflow Oven with Hot Air System Controller
Name:SMT Machine Reflow oven
Brand:No
Model: other
Specification:No
Condition:original
Quality:top qualiy
Stock:large
Payment:T/T before shipment
Shipment:on-time shipment
Warranty: 1 year
Delivery:fedex,ups,dhl,as required
Package:carton box with foam protect
The Reflow Oven is a high-quality and efficient device used for
soldering electronic components onto printed circuit boards (PCBs).
It utilizes the principles of infrared (IR) radiation and
convection heating to achieve precise and uniform temperature
control during the soldering process.
Equipped with advanced features and cutting-edge technology, the
Reflow Oven is an essential tool in the electronics manufacturing
industry. It helps to ensure the reliability and durability of
electronic devices by enabling secure solder connections between
components and PCBs.
The oven consists of a conveyor belt system that transports the
PCBs through different heating zones. These zones include
preheating, soaking, and reflow zones, each with its own
temperature profile and duration. The preheating zone gradually
raises the temperature of the PCBs to a point where the solder can
melt and form solid connections.
In the soaking zone, the PCBs are held at a constant temperature
for a specific period. This allows the solder to reflow completely,
creating reliable solder joints. Finally, in the reflow zone, the
PCBs are heated to the peak temperature quickly and cooled down
rapidly, locking the solder joints in place.
The Reflow Oven is designed to accommodate different PCB sizes and
shapes, allowing for flexibility in production. It offers precise
temperature control within a narrow range, ensuring consistent
soldering results across multiple batches.
Additionally, the oven is equipped with a user-friendly interface,
allowing operators to set and adjust parameters easily. It also
features a monitoring system that provides real-time data on
temperature profiles and production status, facilitating process
optimization and quality control.
The Reflow Oven is highly efficient, with a short heat-up time and
rapid cooldown capability. This enhances productivity by reducing
production cycle times and maximizing throughput.
Furthermore, the Reflow Oven is designed with safety features to
protect operators and prevent damage to the PCBs. These include
thermal sensors, emergency stops, and automated cooling systems.
In summary, the Reflow Oven is an advanced and reliable device for
soldering electronic components onto PCBs. With its precision,
efficiency, and user-friendly features, it is an indispensable tool
in the electronics manufacturing industry, contributing to the
production of high-quality and durable electronic devices.
| Model | RF-8800PC/LS-LF | RF-660PC/LS-LF | RF-6620PC/LS-LF |
| Shape size | 4200x850x1450mm | 3500x850x1450mm | 4000x1000x1550mm |
| Weight | 900kg | 700kg | 850kg |
| Number of heating areas | 上Top8/下Bottom8 | 上Top6/下Bottom6 | 上Top6/下Bottom6 |
| Length of heating zone | 2800mm | 2400mm | 2600mm |
| Cooling quantity | 下Bottom1 | 下Bottom1 | 下Bottom1 |
| Air discharge requirement |
10m3/minX2 |
| Power requirements | 3 phase 380V 50/60Hz |
| Starting power | 30KW | 22KW | 24KW |
| Operating power | 6KW | 5Kw | 5.5KW |
| Heating time | Approx:20min |
| Temperature control range | 室温Room temp-320C |
| temperature control | PID closed loop control +SSR driver(电脑+PLC) |
| Temperature control precision | +1C |
| Temperature deviation On PCB | +2°C |
| Abnormal alarm | 恒温后超高温或低温报警Ultra high temperature or low temperature alarm |
| Maximum width of PCB | 50-400mm | 50-400mm | 50-500/550/600mm |
| PCB element height | 上Top40mm |
| Transportation direction | 左-右L-R(Option:右-左R-L) |
| Transportation speed | 0-1800mm/min |
| Transportation height | 900+20mm |
| PCB transport mode | 网带Chain(链条Ribbon选配option) |
