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High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine

Shenzhen Wenzhan Electronic Technology Co., Ltd.
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    Buy cheap High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine from wholesalers
     
    Buy cheap High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine from wholesalers
    • Buy cheap High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine from wholesalers
    • Buy cheap High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine from wholesalers
    • Buy cheap High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine from wholesalers

    High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine

    Ask Lasest Price
    Brand Name : WZ
    Model Number : WZ-GX01
    Price : Negotiable
    Payment Terms : T/T, Western Union, Paypal, Credit card
    Supply Ability : 5000
    Delivery Time : 5-8 days
    • Product Details
    • Company Profile

    High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine

    Semiconductor Packaging Equipment/led/high Precision Die Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder


    Product namedie bonding machine
    Solid crystal cycle>40 ms
    Die bonding position accuracy±0.3 mil
    Dispensing heatingconstant temperature
    Resolution0.5 um
    Chip ring size6 inch
    Image identification256 gray scale
    Fetching pressure20-200 g
    Frequency50 HZ
    Dimension(L*W*H)1545*1080*1715 mm
    Weight1040
    Voltage220 V
    Power1.3 KW

    Wafer Stage System
    The wafer table assembly consists of an X/Y moving platform and a T rotating part. Linear servo controls the movement of the X/Y
    platform so that the center of the wafer is consistent with the center of the image. The motor of X/Y platform is equipped with
    servo driver, HIWIN guide rail and high-precision grating ruler. T rotation can control the wafer to the desired angle.
    Feeding and Receiving System
    The Z-axis of the receiving system uses a stepper motor+screw to control the lifting and lowering of the material box and the
    precise control of the position of each layer. The length and width of the material box can be manually adjusted and locked
    according to actual needs, and the left and right material boxes can be quickly switched.

    Imaging system
    The image system consists of an X/Y/Z three-axis manual precision adjustment platform, a Hikvision high-definition lens barrel
    and a 130w high-speed camera. The X/Y adjustment platform controls the center of the camera and the center of the base island, and
    the Z-axis adjustment platform controls the focal length adjustment.
    Swing arm system
    The pick-and -place system of the welding head is composed of the Z axis and the rotating axis, which controls the rotation of the
    swing arm and the movement of the Z axis to complete the picking and releasing of the wafer from the wafer to the frame. Rotation
    and Z-axis movement are composed of Yaskawa servo motor and precision mechanical structure to provide higher precision and
    stability.
    Operating system
    It adopts Windows 7 system and Chinese operation interface, which has the characteristics of simple operation and smooth
    operation, which is in line with the operation habits of Chinese people.

    High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding MachineHigh Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding MachineHigh Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine


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